Document Type : Original Article
Department of Electronics and Communication Engineering, Koneru Lakshmaiah Education Foundation, Green Fields, Vaddeswaram, Andhra Pradesh, India
This paper introduces and investigates a symmetrical structural design centered around a Nanoscale Fin Field-Effect Transistor (Fin-FET). Employing advanced tcad simulation techniques, the study discusses the characteristics of the Fin-FET. Here, a comprehensive exploration of the device performance across a spectrum of parameters, including drain current, electric field distribution, surface potential variations, energy band configurations, carrier concentration behaviors, and the Ion/Ioff ratio. Through rigorous analysis, the research sheds light on the symmetrical design's impact on these fundamental aspects of the Fin-FET's operation. The insights gained from this study hold the potential to enhance our understanding of device behavior, paving the road for refined designs and optimized utilization of Fin-FET technology in advanced semiconductor applications. Several types of engineering's are applied to test the device under various aspects. Gate engineering, doping engineering, and work function engineering were applied to test the device drain current characteristics. Therefore, this proposed has been widely adopted in modern Nano scale semiconductor devices.