1. Baba, K. and Hatada, R., “Synthesis and properties of tantalum
nitride films formed by ion beam assisted deposition”, Surface and
Coatings Technology, Vol. 84, No. 1–3, (1996), 429–433.
2. Leng, Y.X., Sun, H., Yang, P., Chen, J.Y., Wang, J., Wan, G.J.,
Huang, N., Tian, X.B., Wang, L.P. and Chu, P. K., “Biomedical
properties of tantalum nitride films synthesized by reactive
magnetron sputtering”, Thin Solid Films, No. 398, (2001), 471–
475.
3. Nie, H.B., Xu, S.Y., Wang, S.J., You, L.P., Yang, Z., Ong, C.K., Li,
J. and Liew, T. Y. F., “Structural and electrical properties of
tantalum nitride thin films fabricated by using reactive radiofrequency
magnetron sputtering”, Applied Physic s A,Vol.73,No.2,(2001),229–236.
4. Mendizabal, L., Oedegaard, A., Kongstein, O.E., Lædre, S.,
Walmsley, J., Barriga, J. and Gonzalez, J. J., “TaNX coatings
deposited by HPPMS on SS316L bipolar plates for polymer
electrolyte membrane fuel cells: Correlation between corrosion
current, contact resistance and barrier oxide film formation”,
International Journal of Hydrogen Energy, Vol. 42, No. 5, (2017),
3259–3270.
5. Gladczuk, L., Patel, A., Paur, C.S. and Sosnowski, M., “Tantalum
films for protective coatings of steel”, Thin Solid Films, Vol. 467,
No. 1–2, (2004), 150–157.
6. Face, D.W. and Prober, D. E., “Nucleation of body‐centered‐cubic
tantalum films with a thin niobium underlayer”, Journal of Vacuum
Science & Technology A: Vacuum, Surfaces, and Films, Vol. 5,
No. 6, (1987), 3408–3411.
7. Luzanov, V.A., Vedeneev, A.S., Ryl’kov, V.V., Temiryazeva, M.P.,
Kozlov, A.M., Dukhnovskii, M.P. and Bugaev, A. S., “Synthesis of
thin tantalum films by magnetron sputtering”, Journal of
Communications Technology and Electronics, Vol. 60, No. 12,
(2015), 1325–1327.
8. Levesque, A. and Bouteville, A., “Fabrication and Properties of
Tantalum Film Deposited on Titanium through LP‐CVD from
TaCl5‐H2”, Chemical Vapor Deposition, Vol. 10, No. 1, (2004), 23–28.
9. Mitterer, C., Holler, F., Reitberger, D., Badisch, E., Stoiber, M.,
Lugmair, C., Nöbauer, R., Müller, T. and Kullmer, R., “Industrial
applications of PACVD hard coatings”, Surface and Coatings
Technology, Vol. 163, (2003), 716–722.
10. Bunshah, R.F., Handbook of deposition technologies for films and
coatings: science, technology, and applications, William Andrew,
(1994).
11. Sabour Rouhaghadam, A.R. and Azadi, M., “A review on titanium
nitride and titanium carbide single and multilayer coatings deposited
by plasma assisted chemical vapor deposition”, International
Journal of Engineering - Transaction B: Applications, Vol. 29,
No. 5, (2016), 677–687.
12. Poladi, A., Semnani, H.M., Emadoddin, E., Mahboubi, F. and
Ghomi, H. R., “Nanostructured TaC Film deposited by reactive
magnetron sputtering: influence of gas concentration on structural,
mechanical, wear and corrosion properties”, Ceramics
International, Vol. 45, No. 7, (2019), 8095–8107.
13. Mody, N.R., Hwang, R.Q., Venka-Taraman, S., Angelo, J.E.,
Norwood, D.P. and Gerberich, W. W., “Adhesion and fracture of
tantalum nitride films”, Acta Materialia, Vol. 46, No. 2, (1998),
585–597.
14. Graves, D.B. and Brault, P., “Molecular dynamics for low
temperature plasma–surface interaction studies”, Journal of Physics
D: Applied Physics, Vol. 42, No. 19, (2009), 1–88.
15. Nikravesh, M., Akbari, G.H. and Poladi, A., “A comprehensive
study on the surface tribology of Ta thin film using molecular
dynamics simulation: the effect of TaN interlayer, power and
temperature”, Tribology International, Vol. 105, (2017), 185–192.
16. Firouzabadi, S.S., Dehghani, K., Naderi, M. and Mahboubi, F.,
“Numerical investigation of sputtering power effect on nanotribological
properties of tantalum-nitride film using molecular
dynamics simulation”, Applied Surface Science, Vol. 367, (2016),
197–204.
17. Ghorbani, H., Poladi, A. and Hajian, M., “Pulsed DC-Plasma
Assisted Chemical Vapor Deposition of α-rich Nanostructured
Tantalum Film: Synthesis and Characterization”, International
Journal of Engineering - Transaction A: Basics, Vol. 30, No. 4,
(2017), 551–557.
18. Chen, B.H. and Chang, S. C., “Thin film deposition on a corrugated
surface: A molecular dynamics approach”, Nuclear Instruments
and Methods in Physics Research Section B: Beam Interactions
with Materials and Atoms, Vol. 260, No. 2, (2007), 517–524.
19. Amaya-Roncancio, S., Arias-Mateus, D.F., Gómez-Hermida, M.M.,
Riano-Rojas, J.C. and Restrepo-Parra, E., “Molecular dynamics
simulations of the temperature effect in the hardness on Cr and CrN
films”, Applied Surface Science, Vol. 258, No. 10, (2012), 4473–
4477.
20. Venkataraj, S., Kittur, H., Drese, R. and Wuttig, M., “Multitechnique
characterization
of
tantalum
oxynitride
films
prepared
by
reactive
direct current magnetron sputtering”, Thin Solid Films,
Vol. 514, No. 1–2, (2006), 1–9.
21. Stukowski, A., “Visualization and analysis of atomistic simulation
data with OVITO–the Open Visualization Tool”, Modelling and
Simulation in Materials Science and Engineering, Vol. 18, No. 1,
(2009), 1–7.
22. Zhang, L., Xie, C. and Wu, J., “Effect of annealing temperature on
surface morphology and mechanical properties of sputter-deposited
Ti–Ni thin films”, Journal of Alloys and Compounds, Vol. 427, No.
1–2, (2007), 238–243.
23. Plimpton, S., Fast parallel algorithms for short-range molecular
dynamics (No. SAND-91-1144), Sandia National Labs.,
Albuquerque, NM (United States), (1993).
24. Konstantinidis, S., Jiang, K., Roobroek, A., Renaux, F. and
Schneider, J. M., “Pulsed plasma enhanced chemical vapor
deposition of alumina thin films: Influence of the duty cycle on
structure and elastic properties”, Plasma Processes and Polymers,
Vol. 8, No. 7, (2011), 651–657.
25. Kamiko, M., Aotani, K., Suenaga, R., Koo, J.W., Nose, K., Kyuno,
K. and Ha, J. G., “The Influence of Ta underlayers on the structure
of TiO2 thin films deposited on an unheated glass substrate”,
Applied Surface Science, Vol. 258, No. 22, (2012), 8764–8768.
26. Yang, J.F., Yuan, Z.G., Wang, X.P. and Fang, Q. F.,
“Characterization of WTaN hard films synthesized by direct current
magnetron sputtering”, Surface and Coatings Technology, Vol.
231, (2013), 19–23.
27. Navid, A.A. and Hodge, A. M., “Nanostructured alpha and beta
tantalum formation—Relationship between plasma parameters and
microstructure”, Materials Science and Engineering: A, Vol. 536,
(2012), 49–56.
28. Gladczuk, L., Patel, A., Demaree, J.D. and Sosnowski, M., “Sputter
deposition of bcc tantalum films with TaN underlayers for protection
of steel”, Thin Solid Films, Vol. 476, No. 2, (2005), 295–302.
29. Navid, A.A., Chason, E. and Hodge, A. M., “Evaluation of stress
during and after sputter deposition of Cu and Ta films”, Surface and
Coatings Technology, Vol. 205, No. 7, (2010), 2355–2361.
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