Developing of Corrosion Resistance Nano Copper Oxide Coating on Copper using Anodization in Oxalate solution

Authors

Department of Manufacturing and Material Engineering, International Islamic University Malaysia, Kuala Lumpur, Malaysia

Abstract

Copper alloys are widely used in the manufacturing of heat transfer applications, this due to their excellent heat transfer properties. Copper contamination is one of the serious industrial problems in the boiler feed water system. This contamination commonly resulted from copper corrosion reactions in boiler feed water environment. The best way to reduce the copper contamination is by improving copper corrosion resistance. This research studies the developing of copper corrosion resistant by using anodization technique. The anodization experiments are conducted in oxalate solutions of concentrations from 0.1 to 0.5 M, at a temperature range from 24 to 0 ο C and applied potential from 7.5 to 9 V. Anodized coating analyzed using Field emission scanning microscope, energy dispersive X-ray spectroscopy, and X-ray diffraction. Characterization results referred to the formation of copper oxide anodized coating with grain size range from 25 to 68 nm. The corrosion resistance of the anodized copper samples carried out in simulated boiler feed water. Results show that the corrosion resistance of the anodized samples was enhanced. The corrosion protection efficiencies for the anodized coating increased 86.2% and 74.5% in testing solutions contains 3.5% NaCl, and 2 mg/l NH3, respectively.

Keywords


1.     Sherif, E.-S.M., "Electrochemical and gravimetric study on the corrosion and corrosion inhibition of pure copper in sodium chloride solutions by two azole derivatives", International Journal of Electrochemical Science,  Vol. 7, (2012), 1482-1495.

2.     Xu, L., Sithambaram, S., Zhang, Y., Chen, C.-H., Jin, L., Joesten, R. and Suib, S.L., "Novel urchin-like cuo synthesized by a facile reflux method with efficient olefin epoxidation catalytic performance", Chemistry of Materials,  Vol. 21, No. 7, (2009), 1253-1259.

3.     Jung, Y.C., "Natural and biomimetic artificial surfaces for superhydrophobicity, self-cleaning, low adhesion, and drag reduction", The Ohio State University,  (2009),

4.     Virk, H.S., Fabrication and characterization of copper nanowires, in Nanowires-implementations and applications. 2011, InTech.

5.     Taghipour, H. and Tanzifi, M., "Modification of polyaniline/polystyrene and polyaniline/metal oxide structure by surfactant", International Journal of Engineering Transaction B,  Vol. 27, (2014), 227-238.

6.     Badiei, E., Sangpour, P., Bagheri, M. and Pazouki, M., "Graphene oxide antibacterial sheets: Synthesis and characterization (research note)", International Journal of Engineering-Transactions C: Aspects,  Vol. 27, No. 12, (2014), 1803.

7.     Jamal-Abad, M.T. and Zamzamian, A., "Thermal conductivity of Cu and Al-water nanofluids", International Journal of Engineering Transactions B: Application,  Vol. 26, No. 8, (2013), 821-828.

8.     Jamshidi, N., Farhadi, M., Ganji, D. and Sedighi, K., "Experimental investigation on the viscosity of nanofluids",  International Journal of Engineering, Transactions B: Applications, Vol. 25 No. 3, (2012), 201–209.

9.     Enright, R., Miljkovic, N., Dou, N., Nam, Y. and Wang, E.N., "Condensation on superhydrophobic copper oxide nanostructures", Journal of Heat Transfer,  Vol. 135, No. 9, (2013), 091304.

10.   Darzi, A.A.R., Farhadi, M. and Sedighi, K., "Experimental investigation of convective heat transfer and friction factor of Al2O3/water nanofluid in helically corrugated tube", Experimental Thermal and Fluid Science,  Vol. 57, (2014), 188-199.

11.   Lowalekar, V.P., "Oxalic acid based chemical systems for electrochemical mechanical planarization of copper",  Ph.D. Degree Dissertation from the department materials science and engineering, The University of Arizona, (2006).

12.   Caballero-Briones, F., Palacios-Padrós, A., Calzadilla, O. and Sanz, F., "Evidence and analysis of parallel growth mechanisms in Cu2O films prepared by cu anodization", Electrochimica Acta,  Vol. 55, No. 14, (2010), 4353-4358.

13.   Chen, L.-C., Chen, C.-C., Liang, K.-C., Chang, S.H., Tseng, Z.-L., Yeh, S.-C., Chen, C.-T., Wu, W.-T. and Wu, C.-G., "Nano-structured CuO- Cu2O complex thin film for application in CH3NH3PbI3 perovskite solar cells", Nanoscale Research Letters,  Vol. 11, No. 1, (2016), 402-410.

14.   Zerbino, J.O., Sánchez, R.M.T. and Sustersic, M.G., "Effect of oxalate on the growth of cuprous oxide layers on copper electrodes. Ellipsometric and isoelectric point study", Acta Chimica Slovenica,  Vol. 56, No. 1, (2009), 124-130.

15.   Allam, N.K. and Grimes, C.A., "Electrochemical fabrication of complex copper oxide nanoarchitectures via copper anodization in aqueous and non-aqueous electrolytes", Materials Letters,  Vol. 65, No. 12, (2011), 1949-1955.

16.   Salem, S.B., Achour, Z.B., Thamri, K. and Touayar, O., "Study and characterization of porous copper oxide produced by electrochemical anodization for radiometric heat absorber", Nanoscale Research Letters,  Vol. 9, No. 1, (2014), 577-584.

17.   Ozkazanc, H. and Zor, S., "Electrochemical synthesis of polypyrrole (PPY) and PPYǀmetal composites on copper electrode and investigation of their anticorrosive properties", Progress in Organic Coatings,  Vol. 76, No. 4, (2013), 720-728.

18.   Romeiro, A., Gouveia-Caridade, C. and Brett, C.M., "Polyphenazine films as inhibitors of copper corrosion", Journal of Electroanalytical Chemistry,  Vol. 688, (2013), 282-288.

19.   Monshi, A., Foroughi, M.R. and Monshi, M.R., "Modified scherrer equation to estimate more accurately nano-crystallite size using xrd", World Journal of Nano Science and Engineering,  Vol. 2, No. 3, (2012), 154-160.

20.   Spinks, G.M., Dominis, A.J., Wallace, G.G. and Tallman, D.E., "Electroactive conducting polymers for corrosion control", Journal of Solid State Electrochemistry,  Vol. 6, No. 2, (2002), 85-100.