Document Type: Original Article
Department of Mechanical and Instrumental Engineering,
Peoples&#039; Friendship University of Russia (RUDN)
Department of Mechanical and Instrumental Engineering, Peoples' Friendship University of Russia (RUDN)
Department of Electrical Engineering, Islamshahr Branch, Islamic Azad University
In this study, the authors have attempted to design a high-performance single-wall carbon nanotube bundle interconnects in a full adder. To achieve this purpose, the circuit performance was investigated using simulation in HSPICE software and considering the technology of 32-nm. Next, the effects of geometric parameters including the diameter of a nanotube, distance between nanotubes in a bundle, and width and length of the bundle were analyzed on the performance of SWCNT bundle interconnects in a full adder using Taguchi Approach (TA). The results of Taguchi Sensitivity Analysis (TSA) showed that the bundle length is the most effective parameter on the circuit performance (about 51% on the power dissipation and about 47% on the propagation delay). Moreover, the distance between nanotubes greatly affects the response than other parameters. Also, Response Surface Method (RSM) indicated that an increase in the length of interconnects (L) improves the output of power dissipation. As the width of interconnects (W) and diameter of CNTs (D) increase the power dissipation also increases. Decrease in the distance between CNTs in a bundle (d) leads to an increase of power dissipation. The highest value of power dissipation is achieved if the maximum values for the parameters of length and width of interconnects, and diameter of CNTs and the minimum value of the distance between CNTs in a bundle are considered. It is also revealed that an increase in the length of interconnects increases the propagation delay. Eventually, the performance of the optimized system was compared using different methods.